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GSR Technology introduces a new 5″ High bright,...
The High Bright LCD display screen provides clear, crisp images that can...
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The demand for small form factors for space-constrained embedded application is increasing rapidly. In response to this requirement, DFI gladly introduces you to ultra-small size products which includes industrial motherboards and system-on-modules based on the new generation Intel® Atom™ processor E3900 series (code name: Apollo Lake). Compared to the last generation Atom (N3700 Series), the brand new DFI product family supports harsh environments and narrow space operations with 30% higher performance and impressively optimized energy efficiency. These products are ideally designed for IoT, automation, transportation, and medical applications.
Rugged Design and Energy-Efficiency for Deeply Embedded Applications Based on Intel® Atom™ Processor E3900 Series
DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.
A wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express and Qseven R2.1 are now available with the new E3900 series processor from GSR Technology.
The High Bright LCD display screen provides clear, crisp images that can...
Read MoreGSR Technology is delighted to announce that following the inaugural Clarience Technologies...
Read MoreGSR Technology would like to introduce it’s new 1500 nits sunlight readable...
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